Electroplated nickel gold is more typically utilised on IC substrates (such as PBGA), mainly for binding gold wires and copper wires; but when electroplating C substrates, additional conductive wires should be made for the gold finger binding area prior to electroplating. Which means DFA is in entire effect for one-sided https://hdi-pcb-for-electronic-pr18370.theisblog.com/31426910/not-known-factual-statements-about-4-layer-communication-pcb